Evaluation of grinding-induced subsurface damage in optical glass BK7

Keyphrases

• Subsurface Damage 100%
• BK7 Glass 100%
• Grinding Process 40%
• Depth of Cut 20%
• Brittle Materials 10%
• Wheel Speed 10%
• In Situ 10%
• Analytical Calculation 10%
• Undeformed chip Thickness 10%
• Damage Monitoring 10%
• Grinding Kinematics 10%
• Operator Skill 10%
• Profilometer 10%
• Machining Parameters 10%
• Infeed 10%
• Crack System 10%
• Damage Value 10%
• Grinding Process Parameters 10%
• Optical Industry 10%
• Workpiece Speed 10%
• Handheld 10%
• Explicit Relationship 10%

Engineering

• Grinding (Machining) 100%
• Subsurface 100%
• Process Parameter 20%
• Brittle Material 10%
• Chip Thickness 10%
• Machining Parameter 10%