Surface defects incorporated diamond machining of silicon

Engineering

• Diamond 100%
• Surface Defect 100%
• Diamond Turning 66%
• Finite Element Method 33%
• Circumferential Direction 33%
• Residual Stress 33%
• Micro Machining 33%
• Average Surface Roughness 33%
• Ultrasonics 16%
• Surface Integrity 16%
• Cutting Force 16%
• Cutting Parameter 16%
• Brittle Material 16%
• Radial Direction 16%
• Gallium Arsenide 16%
• Circumferential 16%
• Subsurface 16%
• Machining Performance 16%
• Silicon Wafer 16%
• Laser Heating 16%
• Made Paper 16%
• Cryogenic Cooling 16%
• Hybrid Micromachining 16%
• Elliptical Vibration 16%

Keyphrases

• Baggage 33%
• Turning Area 33%
• Hybrid Technology 33%
• Electric Pulse 33%
• Machining Mode 33%
• Micromachining Technique 33%
• Ultrasonic Elliptical Vibration 33%