TY - GEN
T1 - Active thermal control of isolated soft switching DC/DC converters
AU - Andresen, Markus
AU - Buticchi, Giampaolo
AU - Liserre, Marco
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/12/21
Y1 - 2016/12/21
N2 - Power Semiconductors undergo thermal stress during operation, which is caused by thermal cycling. This refers to heating up and cooling down of the junction temperature and leads to aging and finally failures. Active thermal control can reduce the thermal stress of power semiconductors by regulating the power losses. Most algorithms proposed so far are only applicable to hard switching power converters and implement a regulation of the switching frequency, which is not applicable for the isolated DC/DC converters. This work proposes to regulate the duty cycle of the DC/DC converter to control the semiconductor losses, aiming at influencing the consequent thermal stress. The proposed algorithm is analyzed analytically and a thermal controller is designed, which is capable of reducing thermal cycles during operation without prior knowledge about the mission profile. The capability and the limitations of the proposed algorithm are demonstrated with simulations and the effectiveness is validated on a laboratory prototype with junction temperature measurement.
AB - Power Semiconductors undergo thermal stress during operation, which is caused by thermal cycling. This refers to heating up and cooling down of the junction temperature and leads to aging and finally failures. Active thermal control can reduce the thermal stress of power semiconductors by regulating the power losses. Most algorithms proposed so far are only applicable to hard switching power converters and implement a regulation of the switching frequency, which is not applicable for the isolated DC/DC converters. This work proposes to regulate the duty cycle of the DC/DC converter to control the semiconductor losses, aiming at influencing the consequent thermal stress. The proposed algorithm is analyzed analytically and a thermal controller is designed, which is capable of reducing thermal cycles during operation without prior knowledge about the mission profile. The capability and the limitations of the proposed algorithm are demonstrated with simulations and the effectiveness is validated on a laboratory prototype with junction temperature measurement.
UR - http://www.scopus.com/inward/record.url?scp=85010046966&partnerID=8YFLogxK
U2 - 10.1109/IECON.2016.7793676
DO - 10.1109/IECON.2016.7793676
M3 - Conference contribution
AN - SCOPUS:85010046966
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 6818
EP - 6823
BT - Proceedings of the IECON 2016 - 42nd Annual Conference of the Industrial Electronics Society
PB - IEEE Computer Society
T2 - 42nd Conference of the Industrial Electronics Society, IECON 2016
Y2 - 24 October 2016 through 27 October 2016
ER -