TY - GEN
T1 - Challenges and Future opportunities of Hairpin Technologies
AU - Arzillo, A.
AU - Braglia, P.
AU - Nuzzo, S.
AU - Barater, D.
AU - Franceschini, G.
AU - Gerada, D.
AU - Gerada, C.
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/6
Y1 - 2020/6
N2 - Hairpin windings are seeing an ever-increasing application and development in electrical machines designed for high power and torque densities. In fact, due to their inherently high fill factor, they are very attractive in applications, such as transportation, where these characteristics are considered main design objectives. On the other hand, high operating frequencies also contribute to improve power density of electrical machines. However, at high fundamental frequencies, hairpin windings are characterised by increased Joule losses due to skin and proximity effects. Hence, while these technologies are introducing new opportunities, a number of challenges still need to be addressed. These include manufacturing aspects, contacting processes, thermal management, etc. This paper presents an overview of the current state-of-the-art of hairpin technologies and propose possible future opportunities. The authors' perspective is then finally provided, showing how innovative winding patterns can potentially overcome the above mentioned challenges.
AB - Hairpin windings are seeing an ever-increasing application and development in electrical machines designed for high power and torque densities. In fact, due to their inherently high fill factor, they are very attractive in applications, such as transportation, where these characteristics are considered main design objectives. On the other hand, high operating frequencies also contribute to improve power density of electrical machines. However, at high fundamental frequencies, hairpin windings are characterised by increased Joule losses due to skin and proximity effects. Hence, while these technologies are introducing new opportunities, a number of challenges still need to be addressed. These include manufacturing aspects, contacting processes, thermal management, etc. This paper presents an overview of the current state-of-the-art of hairpin technologies and propose possible future opportunities. The authors' perspective is then finally provided, showing how innovative winding patterns can potentially overcome the above mentioned challenges.
KW - Contacting
KW - fill factor
KW - hairpin
KW - modelling
UR - http://www.scopus.com/inward/record.url?scp=85089484378&partnerID=8YFLogxK
U2 - 10.1109/ISIE45063.2020.9152417
DO - 10.1109/ISIE45063.2020.9152417
M3 - Conference contribution
AN - SCOPUS:85089484378
T3 - IEEE International Symposium on Industrial Electronics
SP - 277
EP - 282
BT - 2020 IEEE 29th International Symposium on Industrial Electronics, ISIE 2020 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Symposium on Industrial Electronics, ISIE 2020
Y2 - 17 June 2020 through 19 June 2020
ER -