Computational design and optimisation of mechanically reinforced masks for stencil lithography

Maryna Lishchynska, Marc A.F. Van Den Boogaart, Juergen Brugger, James C. Greer

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

Identifying, predicting and optimising stencil lithography is critical to the successful and timely development of this technique with a wide range of potential applications such as deposition on non-conventional and unstable materials (i.e. bio-chemical, hydrophobic), patterning heterostructures (epitaxial, magnetic, complex oxides, piezoelectric materials) and deposition of nanodevices onto CMOS. Previously confirmed for cantilever-like stencils is the thesis that degrading effects of stress-induced deformation of stencils can be overcome by strategic placement of corrugating structures. This approach is further exploited in this work to mechanically stabilise complex stencil designs. This involved studying the evolution of stencil deformation due to deposition induced stress and iterative design of optimal corrugation structures to be incorporated into the stencils. It is shown that degrading effects of stress-induced deformation of stencils can be significantly reduced which subsequently improves pattern definition. Reduction in deformation and in pattern distortion in the range of 50%. to 96% was achieved.

Original languageEnglish
Title of host publicationEuroSime 2007
Subtitle of host publicationInternational Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom
Duration: 16 Apr 200718 Apr 2007

Publication series

NameEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Conference

ConferenceEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Country/TerritoryUnited Kingdom
CityLondon
Period16/04/0718/04/07

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

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