TY - GEN
T1 - Computational design and optimisation of mechanically reinforced masks for stencil lithography
AU - Lishchynska, Maryna
AU - Van Den Boogaart, Marc A.F.
AU - Brugger, Juergen
AU - Greer, James C.
PY - 2007
Y1 - 2007
N2 - Identifying, predicting and optimising stencil lithography is critical to the successful and timely development of this technique with a wide range of potential applications such as deposition on non-conventional and unstable materials (i.e. bio-chemical, hydrophobic), patterning heterostructures (epitaxial, magnetic, complex oxides, piezoelectric materials) and deposition of nanodevices onto CMOS. Previously confirmed for cantilever-like stencils is the thesis that degrading effects of stress-induced deformation of stencils can be overcome by strategic placement of corrugating structures. This approach is further exploited in this work to mechanically stabilise complex stencil designs. This involved studying the evolution of stencil deformation due to deposition induced stress and iterative design of optimal corrugation structures to be incorporated into the stencils. It is shown that degrading effects of stress-induced deformation of stencils can be significantly reduced which subsequently improves pattern definition. Reduction in deformation and in pattern distortion in the range of 50%. to 96% was achieved.
AB - Identifying, predicting and optimising stencil lithography is critical to the successful and timely development of this technique with a wide range of potential applications such as deposition on non-conventional and unstable materials (i.e. bio-chemical, hydrophobic), patterning heterostructures (epitaxial, magnetic, complex oxides, piezoelectric materials) and deposition of nanodevices onto CMOS. Previously confirmed for cantilever-like stencils is the thesis that degrading effects of stress-induced deformation of stencils can be overcome by strategic placement of corrugating structures. This approach is further exploited in this work to mechanically stabilise complex stencil designs. This involved studying the evolution of stencil deformation due to deposition induced stress and iterative design of optimal corrugation structures to be incorporated into the stencils. It is shown that degrading effects of stress-induced deformation of stencils can be significantly reduced which subsequently improves pattern definition. Reduction in deformation and in pattern distortion in the range of 50%. to 96% was achieved.
UR - http://www.scopus.com/inward/record.url?scp=36349019798&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2007.359934
DO - 10.1109/ESIME.2007.359934
M3 - Conference contribution
AN - SCOPUS:36349019798
SN - 1424411068
SN - 9781424411061
T3 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
BT - EuroSime 2007
T2 - EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Y2 - 16 April 2007 through 18 April 2007
ER -