Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites

Ming Zhang; Xuefeng An; Bangming Tang; Xiaosu Yi

Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites

Ming Zhang, Xuefeng An, Bangming Tang, Xiaosu Yi

Research output: Journal Publication › Article › peer-review

18 Citations (Scopus)

Abstract

The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (T_g) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of T_g as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be α_gel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be T_{g, gel}=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.

Original language	English
Pages (from-to)	17-25
Number of pages	9
Journal	Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Volume	23
Issue number	1
Publication status	Published - Feb 2006
Externally published	Yes

Keywords

Cure kinetic
Epoxy resin
Gelation
TTT diagram

ASJC Scopus subject areas

Ceramics and Composites
General Chemistry
Condensed Matter Physics
Mechanics of Materials

Cite this

@article{bb50924837d746719db001fe4867ea01,

title = "Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites",

abstract = "The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (Tg) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of Tg as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be αgel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be Tg, gel=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.",

keywords = "Cure kinetic, Epoxy resin, Gelation, TTT diagram",

author = "Ming Zhang and Xuefeng An and Bangming Tang and Xiaosu Yi",

year = "2006",

month = feb,

language = "English",

volume = "23",

pages = "17--25",

journal = "Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica",

issn = "1000-3851",

publisher = "Beijing University of Aeronautics and Astronautics (BUAA)",

number = "1",

}

TY - JOUR

T1 - Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites

AU - Zhang, Ming

AU - An, Xuefeng

AU - Tang, Bangming

AU - Yi, Xiaosu

PY - 2006/2

Y1 - 2006/2

N2 - The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (Tg) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of Tg as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be αgel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be Tg, gel=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.

AB - The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (Tg) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of Tg as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be αgel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be Tg, gel=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.

KW - Cure kinetic

KW - Epoxy resin

KW - Gelation

KW - TTT diagram

UR - http://www.scopus.com/inward/record.url?scp=33646718653&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:33646718653

SN - 1000-3851

VL - 23

SP - 17

EP - 25

JO - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

JF - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

IS - 1

ER -

Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites

Abstract

Keywords

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this