Mobility and kinematic paths of foldable origami structures

Jianguo Cai, Zelun Qian, Jian Feng, Chao Jiang, Yixiang Xu

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

As one new type of deployable structures, foldable plate structures based on origami are more and more widely used in aviation and building structures in recent years. The mobility and kinematic paths of foldable origami structures are studied in this paper. Different constraints including the rigid plate, pin joints and the boundary conditions of linkages were firstly used to generate the system constraint equations. Then the degree of freedom (DOF) of the foldable plate structures was calculated from the dimension of null space of the Jacobian matrix, which is the derivative of the constraint equations with respect to time. Furthermore, the redundant constraints were found by using this method and multiple kinematic paths existing in origami structures were studied by obtaining all solutions of constraint equations. Different solutions represent different kinematic configurations. The degree of freedom and kinematic paths of a Miura-ori and a rigid deployable antenna were also investigated in details.

Original languageEnglish
Title of host publication40th Mechanisms and Robotics Conference
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791850169
DOIs
Publication statusPublished - 2016
Externally publishedYes
EventASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2016 - Charlotte, United States
Duration: 21 Aug 201624 Aug 2016

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume5B-2016

Conference

ConferenceASME 2016 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2016
Country/TerritoryUnited States
CityCharlotte
Period21/08/1624/08/16

ASJC Scopus subject areas

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modelling and Simulation

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