Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

Saurav Goel; Xichun Luo; R. L. Reuben; W. B. Rashid; Jining Sun

doi:10.4028/www.scientific.net/KEM.496.223

Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

Saurav Goel, Xichun Luo, R. L. Reuben, W. B. Rashid, Jining Sun

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

Original language	English
Title of host publication	Precision Machining VI
Publisher	Trans Tech Publications Ltd
Pages	223-228
Number of pages	6
ISBN (Print)	9783037852972
DOIs	https://doi.org/10.4028/www.scientific.net/KEM.496.223
Publication status	Published - 2012
Externally published	Yes
Event	6th International Congress of Precision Machining, ICPM2011 - Liverpool, Merseyside, United Kingdom Duration: 13 Sept 2011 → 15 Sept 2011

Publication series

Name	Key Engineering Materials
Volume	496
ISSN (Print)	1013-9826
ISSN (Electronic)	1662-9795

Conference

Conference	6th International Congress of Precision Machining, ICPM2011
Country/Territory	United Kingdom
City	Liverpool, Merseyside
Period	13/09/11 → 15/09/11

Keywords

MD simulations
Single crystal silicon
Single point diamond turning

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Mechanical Engineering

Access to Document

10.4028/www.scientific.net/KEM.496.223

Cite this

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title = "Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon",

abstract = "Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.",

keywords = "MD simulations, Single crystal silicon, Single point diamond turning",

author = "Saurav Goel and Xichun Luo and Reuben, {R. L.} and Rashid, {W. B.} and Jining Sun",

year = "2012",

doi = "10.4028/www.scientific.net/KEM.496.223",

language = "English",

isbn = "9783037852972",

series = "Key Engineering Materials",

publisher = "Trans Tech Publications Ltd",

pages = "223--228",

booktitle = "Precision Machining VI",

note = "6th International Congress of Precision Machining, ICPM2011 ; Conference date: 13-09-2011 Through 15-09-2011",

}

Goel, S, Luo, X, Reuben, RL, Rashid, WB & Sun, J 2012, Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon. in Precision Machining VI. Key Engineering Materials, vol. 496, Trans Tech Publications Ltd, pp. 223-228, 6th International Congress of Precision Machining, ICPM2011, Liverpool, Merseyside, United Kingdom, 13/09/11. https://doi.org/10.4028/www.scientific.net/KEM.496.223

Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon. / Goel, Saurav; Luo, Xichun; Reuben, R. L. et al.
Precision Machining VI. Trans Tech Publications Ltd, 2012. p. 223-228 (Key Engineering Materials; Vol. 496).

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

AU - Goel, Saurav

AU - Luo, Xichun

AU - Reuben, R. L.

AU - Rashid, W. B.

AU - Sun, Jining

PY - 2012

Y1 - 2012

N2 - Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

AB - Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.

KW - MD simulations

KW - Single crystal silicon

KW - Single point diamond turning

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DO - 10.4028/www.scientific.net/KEM.496.223

M3 - Conference contribution

AN - SCOPUS:84862926277

SN - 9783037852972

T3 - Key Engineering Materials

SP - 223

EP - 228

BT - Precision Machining VI

PB - Trans Tech Publications Ltd

T2 - 6th International Congress of Precision Machining, ICPM2011

Y2 - 13 September 2011 through 15 September 2011

ER -

Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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