Layered Al₂O₃-SiO₂ and Al₂O₃-Ta₂O₅ thin-film composites for high dielectric strength, deposited by pulsed direct current and radio frequency magnetron sputtering

Material Science

• Al2O3 100%
• Bond Strength (Materials) 10%
• Conductor 10%
• Delamination 10%
• Dielectric Material 100%
• Film 20%
• Magnetron Sputtering 100%
• Mechanical Strength 100%
• Thermal Expansion 10%
• Thin Films 100%

Keyphrases

• Coating Adhesion 14%
• Coating Stress 14%
• Copper Conductor 14%
• Dielectric Strength 42%
• Four-layer 14%
• High Breakdown Strength 14%
• High Dielectric Strength 100%
• Interfacial Delamination 14%
• Multilayer Thin Films 14%
• Pulsed Direct Current 100%
• Radio Frequency Magnetron Sputtering 100%
• Ta2O5 Thin Film 100%